"IEEE International conference on Physical Assurance and Inspection on
Electronics" (PAINE), is to be held on July 28-29, 2020 in
Washington, DC. PAINE is supported by "Reliability Society" and
accepted papers will be published in IEEE Xplore after peer review by

PAINE offers an exciting venue to researchers and practitioners in the
field of Hardware Security and Trust who research and develop physical
assurance and analysis. PAINE brings together experts from government,
instrumentation, original component manufacturers (OCMs), original
equipment manufacturers (OEMs), and academic researchers together to
share ideas and solutions to make electronics devices and systems safe
and secure.

Topics covered are including but not limited to:
  *   Image analysis and artificial intelligence for assurance and inspection
  *   Novel material and devices for assurance
  *   Sample Preparation
  *   PCB trust and assurance
  *   Chip and PCB level decomposition for assurance
  *   Side channel assessment (power, timing, EM) for assurance and
  *   FIB/SEM for assurance
  *   Electro-optical probing using PEM, EOP, EOFM, etc.
  *   Physical/side channel fingerprinting
  *   Mod-chip on PCB
  *   Microprobing and nanoprobing
  *   Bus-snooping
  *   Fault injection assessment and countermeasures
  *   Field-based weakness
  *   Countermeasures against tampering and decomposition
  *   Physical/logical shielding, etc.
  *   FPGA Bitstream protection and vulnerabilities
  *   Analog & mixed-signal circuits and systems security
  *   Emerging topics in physical inspection and assurance
  *   Security primitives: Novel devices, materials, and systems
  *   Trojans and backdoors: Detection and prevention
  *   Counterfeit Detection and Anti-Counterfeit Technique

Full Paper (5 pages):  March 11, 2020
Notification of Acceptance: April 28, 2020
Camera ready version: May 17 , 2020


Technical Program:  Navid Asadi (Program Chair), University of Florida
E-mail: nasadi@ece.ufl.edunasadi@ece.ufl.edu>

General Information: Mark Tehranipoor (General Chair), University of Florida
E-mail: tehranipoor@ece.ufl.edu

This event is open to public; we encourage everyone from academia,
industry, and government to attend.